Field, D. P., Muppidi, T., Sanchez, J. E. (2006) Electron backscatter diffraction characterization of inlaid cu lines for interconnect applications. Scanning, 25 (6). 309-315 doi:10.1002/sca.4950250607
| Reference Type | Journal (article/letter/editorial) | ||
|---|---|---|---|
| Title | Electron backscatter diffraction characterization of inlaid cu lines for interconnect applications | ||
| Journal | Scanning | ||
| Authors | Field, D. P. | Author | |
| Muppidi, T. | Author | ||
| Sanchez, J. E. | Author | ||
| Year | 2006 (December 6) | Volume | 25 |
| Issue | 6 | ||
| Publisher | Wiley | ||
| DOI | doi:10.1002/sca.4950250607Search in ResearchGate | ||
| Generate Citation Formats | |||
| Mindat Ref. ID | 6445865 | Long-form Identifier | mindat:1:5:6445865:6 |
| GUID | 0 | ||
| Full Reference | Field, D. P., Muppidi, T., Sanchez, J. E. (2006) Electron backscatter diffraction characterization of inlaid cu lines for interconnect applications. Scanning, 25 (6). 309-315 doi:10.1002/sca.4950250607 | ||
| Plain Text | Field, D. P., Muppidi, T., Sanchez, J. E. (2006) Electron backscatter diffraction characterization of inlaid cu lines for interconnect applications. Scanning, 25 (6). 309-315 doi:10.1002/sca.4950250607 | ||
| In | (2006, December) Scanning Vol. 25 (6) Wiley | ||
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