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Mokhtar, N.Z.M., Salleh, M.A.A.M., Zhang, G.M., Harvey, D.M., Nabialek, M., Hashim, A.N., Nazri, S.F. (2020) Tin Whiskers Formation in Sn0.7Cu0.05Ni1.5Bi under Electro-Migration Stressing. Acta Physica Polonica A, 138 (2) 261-264 doi:10.12693/aphyspola.138.261

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Reference TypeJournal (article/letter/editorial)
TitleTin Whiskers Formation in Sn0.7Cu0.05Ni1.5Bi under Electro-Migration Stressing
JournalActa Physica Polonica A
AuthorsMokhtar, N.Z.M.Author
Salleh, M.A.A.M.Author
Zhang, G.M.Author
Harvey, D.M.Author
Nabialek, M.Author
Hashim, A.N.Author
Nazri, S.F.Author
Year2020 (August)Volume138
Issue2
PublisherInstitute of Physics, Polish Academy of Sciences
DOIdoi:10.12693/aphyspola.138.261Search in ResearchGate
Generate Citation Formats
Mindat Ref. ID13831781Long-form Identifiermindat:1:5:13831781:4
GUID0
Full ReferenceMokhtar, N.Z.M., Salleh, M.A.A.M., Zhang, G.M., Harvey, D.M., Nabialek, M., Hashim, A.N., Nazri, S.F. (2020) Tin Whiskers Formation in Sn0.7Cu0.05Ni1.5Bi under Electro-Migration Stressing. Acta Physica Polonica A, 138 (2) 261-264 doi:10.12693/aphyspola.138.261
Plain TextMokhtar, N.Z.M., Salleh, M.A.A.M., Zhang, G.M., Harvey, D.M., Nabialek, M., Hashim, A.N., Nazri, S.F. (2020) Tin Whiskers Formation in Sn0.7Cu0.05Ni1.5Bi under Electro-Migration Stressing. Acta Physica Polonica A, 138 (2) 261-264 doi:10.12693/aphyspola.138.261
In(2020, August) Acta Physica Polonica A Vol. 138 (2) Institute of Physics, Polish Academy of Sciences

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