Zhou, Shuang, Lei, Qian, Yin, Jie, Gan, Wenbo, Hou, Yuhao, Meng, Xiangpeng (2023) Microstructure and mechanical properties of a Cu-1.28Cr-0.24P alloy with high electrical conductivity and tensile strength. Materials Chemistry and Physics, 308. Elsevier BV. 128164 doi:10.1016/j.matchemphys.2023.128164
| Reference Type | Journal (article/letter/editorial) | ||
|---|---|---|---|
| Title | Microstructure and mechanical properties of a Cu-1.28Cr-0.24P alloy with high electrical conductivity and tensile strength | ||
| Journal | Materials Chemistry and Physics | ||
| Authors | Zhou, Shuang | Author | |
| Lei, Qian | Author | ||
| Yin, Jie | Author | ||
| Gan, Wenbo | Author | ||
| Hou, Yuhao | Author | ||
| Meng, Xiangpeng | Author | ||
| Year | 2023 (October) | Volume | 308 |
| Publisher | Elsevier BV | ||
| DOI | doi:10.1016/j.matchemphys.2023.128164Search in ResearchGate | ||
| Generate Citation Formats | |||
| Mindat Ref. ID | 16640386 | Long-form Identifier | mindat:1:5:16640386:2 |
| GUID | 0 | ||
| Full Reference | Zhou, Shuang, Lei, Qian, Yin, Jie, Gan, Wenbo, Hou, Yuhao, Meng, Xiangpeng (2023) Microstructure and mechanical properties of a Cu-1.28Cr-0.24P alloy with high electrical conductivity and tensile strength. Materials Chemistry and Physics, 308. Elsevier BV. 128164 doi:10.1016/j.matchemphys.2023.128164 | ||
| Plain Text | Zhou, Shuang, Lei, Qian, Yin, Jie, Gan, Wenbo, Hou, Yuhao, Meng, Xiangpeng (2023) Microstructure and mechanical properties of a Cu-1.28Cr-0.24P alloy with high electrical conductivity and tensile strength. Materials Chemistry and Physics, 308. Elsevier BV. 128164 doi:10.1016/j.matchemphys.2023.128164 | ||
| In | (2023) Materials Chemistry and Physics Vol. 308. Elsevier BV | ||
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