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Zhou, Shuang, Lei, Qian, Yin, Jie, Gan, Wenbo, Hou, Yuhao, Meng, Xiangpeng (2023) Microstructure and mechanical properties of a Cu-1.28Cr-0.24P alloy with high electrical conductivity and tensile strength. Materials Chemistry and Physics, 308. Elsevier BV. 128164 doi:10.1016/j.matchemphys.2023.128164

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Reference TypeJournal (article/letter/editorial)
TitleMicrostructure and mechanical properties of a Cu-1.28Cr-0.24P alloy with high electrical conductivity and tensile strength
JournalMaterials Chemistry and Physics
AuthorsZhou, ShuangAuthor
Lei, QianAuthor
Yin, JieAuthor
Gan, WenboAuthor
Hou, YuhaoAuthor
Meng, XiangpengAuthor
Year2023 (October)Volume308
PublisherElsevier BV
DOIdoi:10.1016/j.matchemphys.2023.128164Search in ResearchGate
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Mindat Ref. ID16640386Long-form Identifiermindat:1:5:16640386:2
GUID0
Full ReferenceZhou, Shuang, Lei, Qian, Yin, Jie, Gan, Wenbo, Hou, Yuhao, Meng, Xiangpeng (2023) Microstructure and mechanical properties of a Cu-1.28Cr-0.24P alloy with high electrical conductivity and tensile strength. Materials Chemistry and Physics, 308. Elsevier BV. 128164 doi:10.1016/j.matchemphys.2023.128164
Plain TextZhou, Shuang, Lei, Qian, Yin, Jie, Gan, Wenbo, Hou, Yuhao, Meng, Xiangpeng (2023) Microstructure and mechanical properties of a Cu-1.28Cr-0.24P alloy with high electrical conductivity and tensile strength. Materials Chemistry and Physics, 308. Elsevier BV. 128164 doi:10.1016/j.matchemphys.2023.128164
In(2023) Materials Chemistry and Physics Vol. 308. Elsevier BV


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