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Islam, M. S., McNally, P. J. (1998) Effects of Metallization Thickness on the Thermal and Long-Term Stability of Pd/Sn Ohmic Contacts to n-GaAs. physica status solidi (a), 165 (2). 417-426 doi:10.1002/(sici)1521-396x(199802)165:2<417::aid-pssa417>3.0.co;2-s

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Reference TypeJournal (article/letter/editorial)
TitleEffects of Metallization Thickness on the Thermal and Long-Term Stability of Pd/Sn Ohmic Contacts to n-GaAs
Journalphysica status solidi (a)
AuthorsIslam, M. S.Author
McNally, P. J.Author
Year1998 (February)Volume165
Issue2
PublisherWiley
DOIdoi:10.1002/(sici)1521-396x(199802)165:2<417::aid-pssa417>3.0.co;2-sSearch in ResearchGate
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Mindat Ref. ID5083306Long-form Identifiermindat:1:5:5083306:3
GUID0
Full ReferenceIslam, M. S., McNally, P. J. (1998) Effects of Metallization Thickness on the Thermal and Long-Term Stability of Pd/Sn Ohmic Contacts to n-GaAs. physica status solidi (a), 165 (2). 417-426 doi:10.1002/(sici)1521-396x(199802)165:2<417::aid-pssa417>3.0.co;2-s
Plain TextIslam, M. S., McNally, P. J. (1998) Effects of Metallization Thickness on the Thermal and Long-Term Stability of Pd/Sn Ohmic Contacts to n-GaAs. physica status solidi (a), 165 (2). 417-426 doi:10.1002/(sici)1521-396x(199802)165:23.0.co;2-s
In(1998, February) physica status solidi (a) Vol. 165 (2) Wiley

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