Baeck, Suk Min, Park, Kwang Kyun, Ha, Hunphil, Oh, Young Joo, Park, Yong Jin, Moon, Jung Tak, Lee, Jin, Oh, Kyu Hwan (2002) Texture Analysis of Copper Bonding Wire. Materials Science Forum, 408. 803-808 doi:10.4028/www.scientific.net/msf.408-412.803
| Reference Type | Journal (article/letter/editorial) | ||
|---|---|---|---|
| Title | Texture Analysis of Copper Bonding Wire | ||
| Journal | Materials Science Forum | ||
| Authors | Baeck, Suk Min | Author | |
| Park, Kwang Kyun | Author | ||
| Ha, Hunphil | Author | ||
| Oh, Young Joo | Author | ||
| Park, Yong Jin | Author | ||
| Moon, Jung Tak | Author | ||
| Lee, Jin | Author | ||
| Oh, Kyu Hwan | Author | ||
| Year | 2002 (August) | Volume | 408 |
| Publisher | Trans Tech Publications, Ltd. | ||
| DOI | doi:10.4028/www.scientific.net/msf.408-412.803Search in ResearchGate | ||
| Generate Citation Formats | |||
| Mindat Ref. ID | 9852839 | Long-form Identifier | mindat:1:5:9852839:4 |
| GUID | 0 | ||
| Full Reference | Baeck, Suk Min, Park, Kwang Kyun, Ha, Hunphil, Oh, Young Joo, Park, Yong Jin, Moon, Jung Tak, Lee, Jin, Oh, Kyu Hwan (2002) Texture Analysis of Copper Bonding Wire. Materials Science Forum, 408. 803-808 doi:10.4028/www.scientific.net/msf.408-412.803 | ||
| Plain Text | Baeck, Suk Min, Park, Kwang Kyun, Ha, Hunphil, Oh, Young Joo, Park, Yong Jin, Moon, Jung Tak, Lee, Jin, Oh, Kyu Hwan (2002) Texture Analysis of Copper Bonding Wire. Materials Science Forum, 408. 803-808 doi:10.4028/www.scientific.net/msf.408-412.803 | ||
| In | (2002) Materials Science Forum Vol. 408. Trans Tech Publications, Ltd. | ||
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