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Kang, Soo Young, Lee, Dong Nyung (2002) Recrystallization Texture of a Copper Electrodeposit with the <111> and <110> Duplex Orientation. Materials Science Forum, 408. 895-900 doi:10.4028/www.scientific.net/msf.408-412.895

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Reference TypeJournal (article/letter/editorial)
TitleRecrystallization Texture of a Copper Electrodeposit with the <111> and <110> Duplex Orientation
JournalMaterials Science Forum
AuthorsKang, Soo YoungAuthor
Lee, Dong NyungAuthor
Year2002 (August)Volume408
PublisherTrans Tech Publications, Ltd.
DOIdoi:10.4028/www.scientific.net/msf.408-412.895Search in ResearchGate
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Mindat Ref. ID9852854Long-form Identifiermindat:1:5:9852854:3
GUID0
Full ReferenceKang, Soo Young, Lee, Dong Nyung (2002) Recrystallization Texture of a Copper Electrodeposit with the <111> and <110> Duplex Orientation. Materials Science Forum, 408. 895-900 doi:10.4028/www.scientific.net/msf.408-412.895
Plain TextKang, Soo Young, Lee, Dong Nyung (2002) Recrystallization Texture of a Copper Electrodeposit with the and Duplex Orientation. Materials Science Forum, 408. 895-900 doi:10.4028/www.scientific.net/msf.408-412.895
In(2002) Materials Science Forum Vol. 408. Trans Tech Publications, Ltd.


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