| Reference Type | Journal (article/letter/editorial) |
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| Title | Recrystallization Texture of a Copper Electrodeposit with the <111> and <110> Duplex Orientation |
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| Journal | Materials Science Forum |
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| Authors | Kang, Soo Young | Author |
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| Lee, Dong Nyung | Author |
| Year | 2002 (August) | Volume | 408 |
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| Publisher | Trans Tech Publications, Ltd. |
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| DOI | doi:10.4028/www.scientific.net/msf.408-412.895Search in ResearchGate |
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| Generate Citation Formats |
| Mindat Ref. ID | 9852854 | Long-form Identifier | mindat:1:5:9852854:3 |
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| GUID | 0 |
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| Full Reference | Kang, Soo Young, Lee, Dong Nyung (2002) Recrystallization Texture of a Copper Electrodeposit with the <111> and <110> Duplex Orientation. Materials Science Forum, 408. 895-900 doi:10.4028/www.scientific.net/msf.408-412.895 |
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| Plain Text | Kang, Soo Young, Lee, Dong Nyung (2002) Recrystallization Texture of a Copper Electrodeposit with the and Duplex Orientation. Materials Science Forum, 408. 895-900 doi:10.4028/www.scientific.net/msf.408-412.895 |
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| In | (2002) Materials Science Forum Vol. 408. Trans Tech Publications, Ltd. |
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